TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
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TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply models prompted the foundry to adjust its advanced capacity allocation. Supply chain sources said Nvidia and Apple continue to dominate TSMC's advanced process and packaging resources, while AWS has recently expanded AI chip tape-outs, giving Annapurna more 3nm capacity.
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